Uses of conductive silicone products in the electronics industry

With the development of industrial production and science and technology, people continue to put forward new requirements for conductive silica gel materials. In the field of electronics and electrical appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are developing in the direction of being light, thin, and small, and the heat generation is also increasing. Therefore, high thermal conductivity insulation materials are needed to effectively remove electronic equipment. The amount of heat generated is related to the service life and quality reliability of the product. The traditional way to deal with the heat dissipation of electronic equipment is to put a layer of insulating medium between the heating element and the heat sink as a thermal conductive material, such as mica, polytetrafluoroethylene, beryllium oxide ceramics, etc. This method has a certain effect. However, there are defects such as poor thermal conductivity, low mechanical performance, and high price. At present, part of the heat dissipation of electronic equipment is solved by various forms of radiators, but most of them must be solved by thermal conductive materials. Thermal conductive silica gel materials are the most important member of thermal conductive materials. This article will focus on the use of thermal paste and thermal silicone sheets to provide heat conduction solutions for electronic equipment. Thermal conductive silicone rubber material is a typical polymer composite material. Its thermal conductivity performance is mainly determined by the type of thermal conductive filler and the distribution of thermal conductive filler in the silicone rubber matrix. Thermal conductive filler is divided into metal fillers and inorganic non-metallic fillers. The thermal conductivity mechanisms of various fillers are different, which determines the difference in thermal conductivity or thermal conductivity.

Thermal conductive paste is a mechanically mixed paste of silicone oil and thermal conductive filler. It has the characteristics of being ready to shape, high thermal conductivity, non-curing, and non-corrosive to interface materials. In electronic equipment, there are many contact surfaces and mounting surfaces between various electronic components. There are gaps between them, resulting in poor heat flow. In order to solve this problem, thermal paste is usually filled between the contact surfaces. Using thermal paste Move to remove the air between the interfaces and reduce or even eliminate thermal resistance.

Thermal silicone sheet is a sheet-shaped thermally insulating silicone rubber material processed through a special production process. It has the characteristics of natural surface viscosity, high thermal conductivity, high compression resistance, high buffering, etc. It is mainly used in heating equipment and heat sinks. And the gap filling material of the casing, because of its soft material and elasticity under low pressure, can be in close contact with the surface of the device or even rough surface structures, reducing the thermal resistance of the air, and excellently solves the problem of thermal conductive silicone paste After high temperature, there are defects such as silicone oil leakage and dust accumulation on the surface.