Seven Grades, One Mission – Precision Thermal Conductivity with IOTA-HTV 330
Not all thermal interface materials are created equal. Some are too soft for high-pressure assemblies; others are too rigid for effective gap filling. The IOTA-HTV 330 series eliminates that compromise by offering seven distinct hardness grades—from 30 to 80 Shore A—so you can match material behavior to your exact application.
Whether you need a softer pad for delicate electronic packages or a firmer tape for mounting power modules, there is a grade tailored for you. The series includes IOTA-HTV 33030, 33040, 33050, 33060, 33070, 33075, and 33080, each with carefully balanced properties.
Let’s talk numbers that matter. Thermal conductivity spans from 1.0 to 2.5 W/(m·K), depending on the grade, making the series suitable for moderate to high-power dissipation scenarios. Meanwhile, tensile strength ranges from 400 to 800 KN/m, and elongation at break varies between 6% and 11.3%, giving you both strength and flexibility in one package.
The physical properties are equally transparent: density sits between 1.5 and 4.7 g/cm³, and the Williams plasticity index is clearly specified for each grade, so you can predict flow behavior during molding. This level of detail isn't just data—it’s a roadmap for successful part design.
All seven grades share the same curing profile, meaning you can switch between hardness levels without retooling or adjusting press parameters. That’s operational efficiency at its best.
From telecom enclosures to automotive battery cooling plates, the IOTA-HTV 330 series gives you a systematic, grade-by-grade approach to thermal management. Choose the number, get the performance.