When Heat Meets Its Match: The IOTA-HTV 330 Series for Reliable Thermal Management
In the world of power electronics, EV components, and 5G infrastructure, heat is the silent performance killer. Managing it isn’t just about cooling—it’s about consistency, longevity, and safety. That’s exactly why the IOTA-HTV 330 Series of thermal conductive silicone rubber deserves your attention.
Designed with a peroxide (DBPMH) curing system, this family of materials delivers outstanding heat resistance and process stability, especially in compression molding applications. Whether you are manufacturing thermal tapes, gap pads, or custom-shaped heat spreaders, the HTV 330 series provides a straightforward path to high-performance thermal interfaces.
What makes the series stand out is its flexibility across hardness levels. Ranging from 30 to 80 Shore A, these grades allow engineers to fine-tune mechanical feel and compressibility without sacrificing thermal conductivity. With values reaching up to 2.0 W/(m·K), the material bridges the gap between structural integrity and effective heat transfer.
Beyond performance, the HTV 330 series carries global trust marks: it is fully RoHS and REACH compliant. That means fewer regulatory hurdles for your supply chain and faster time-to-market for your finished goods. The material also exhibits high tensile strength and tear resistance, ensuring that thin pads or tapes remain durable during installation and long-term use.
Processing is straightforward: with 1% of a 50% DBPMH paste as a curing agent, the compound cures in just 5 minutes at 175°C under 15 MPa pressure. This efficiency translates into shorter cycle times and higher throughput—ideal for high-volume production lines.
In short, the IOTA-HTV 330 series doesn’t just conduct heat; it gives you design freedom, production reliability, and regulatory peace of mind. If your application demands controlled thermal pathways and robust mechanical properties, this series is ready to perform.