Thermal Tapes, Pads, and Beyond – Unlock New Designs with IOTA-HTV 330
Thermal management is no longer an afterthought—it’s a primary design driver in modern electronics. The IOTA-HTV 330 series empowers design engineers to create thinner, lighter, and more efficient thermal interfaces without compromising on durability or conductivity.
This material is specifically engineered for applications like thermal conductive tapes and gap-filling pads, where both heat transfer and conformability are essential. With hardness options from 30 to 80 Shore A, you can select a grade that matches the clamping pressure of your assembly, ensuring optimal wet-out and minimal thermal contact resistance.
The thermal conductivity range—spanning 1.0 to 2.5 W/(m·K)—covers everything from low-power consumer devices to high-density industrial drives. And because the material maintains stable properties across temperature cycles, your designs remain reliable over years of operation.
What’s more, the HTV 330 series supports creative part geometries. Compression molding allows for custom thicknesses, integrated ribs, and even multi-layer constructions. This opens the door to combined functions: thermal conduction plus vibration damping, or heat spreading plus electrical insulation, depending on your system requirements.
The material also offers excellent aesthetic consistency, with a uniform appearance across all grades, which is important for end-user-facing components in consumer electronics.
Finally, with clear technical data provided for each grade—density, plasticity, hardness, tensile, tear, elongation, and thermal conductivity—you have the full dataset needed to simulate, prototype, and validate your design upfront.
The IOTA-HTV 330 series is more than a material portfolio. It’s a design toolkit for engineers who refuse to settle for “good enough” thermal performance.